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Fiber Bragg Grating Sensors For Failure Detection Of Fip Chip BGA In Four-Point Bending Test

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posted on 23.05.2021, 13:21 by Rasha Hussain
Maintaining structural integrity is an important issue for advanced flip chip ball grid array (FC-BFA) packages especially due to the use of Pb-free solder replacing the Pb-contained solders and the large package size induced mechanical vulnerability. For such packages, the mechanical bending causes fracture in the interconnecting plastic PWB. To determine the critical load becomes a challenge to assembly manufacturers since the conventional testing methods based on monitoring electric continuity of the daisy chained solder joints fail to detect the PWB de-bonding near the interconnect. This thesis researches a new method that uses the Fiber Bragg Grating sensor to detect the interconnect fracture failure of 55 mm lead-free FC-BGA under four-point bend test. Experimental setups and procedures are studied, a proper test configuration is determined and a series of testing performed. The validity of the new method in monitoring the solder joint de-bonding is proved through analyzing the test results, which shows that the FBG sensors are sensitive to capture the onset of the fracture in different cases.





Master of Applied Science


Electrical and Computer Engineering

Granting Institution

Ryerson University

LAC Thesis Type


Thesis Advisor

X. Gu Hua Lu