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Thin wafer dicing using a high repetition rate femtosecond laser

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thesis
posted on 23.05.2021, 11:31 by Nitinkumar Sudani
Thin wafer dicing using a high repetition rate femtosecond laser

History

Language

eng

Degree

Master of Applied Science

Program

Mechanical and Industrial Engineering

Granting Institution

Ryerson University

LAC Thesis Type

Thesis

Thesis Advisor

Krishnan Venkatakrishnan Bo Tan